SUMMIT WIRELESS TECHNOLOGIES INC(WISA)

1.02 0.00 0.0%

今开:0.0昨收:1.02
最高:0.0 最低:0.0
涨停价:0.0跌停价:0.0
总市值:2.02049E7

SUMMIT WIRELESS TECHNOLOGIES INC的热门评论

雪球7x242018-07-28 01:29

Summit半导体周五在美国纳斯达克交易所上市,代码为WISA首日开盘价报5.00美元,与IPO发行价5.00美元/股持平。查看全文

雪球7x242018-07-28 01:19

WISA周五IPO。查看全文

SUMMIT WIRELESS TECHNOLOGIES INC的最新评论

雪球7x242018-07-28 01:29

Summit半导体周五在美国纳斯达克交易所上市,代码为WISA首日开盘价报5.00美元,与IPO发行价5.00美元/股持平。查看全文

雪球7x242018-07-28 01:19

WISA周五IPO。查看全文

SUMMIT WIRELESS TECHNOLOGIES INC的公告

$Summit Semiconductor, Inc(WISA)$ EFFECT - Notice of Effectiveness Filed: 2018-07-25 AccNo: 9999999995-18-001866 Size: 2 KB 网页链接

$Summit Semiconductor, Inc(WISA)$ CERT - Filed: 2018-07-27 AccNo: 0001354457-18-000289 Size: 164 KB 网页链接

$Summit Semiconductor, Inc(WISA)$ 8-K - Current report Filed: 2018-07-31 AccNo: 0001144204-18-041088 Size: 37 KBItem 8.01: Other EventsItem 9.01: Financial Statements and Exhibits 网页链接

$Summit Semiconductor, Inc(WISA)$ 424B4 - Prospectus [Rule 424(b)(4)] Filed: 2018-07-27 AccNo: 0001144204-18-040273 Size: 1 MB 网页链接

$Summit Semiconductor, Inc(WISA)$ 8-A12B - Registration of securities [Section 12(b)] Filed: 2018-07-25 AccNo: 0001144204-18-039919 Size: 18 KB 网页链接

$Summit Semiconductor, Inc(WISA)$ S-1/A [Amend] - General form for registration of securities under the Securities Act of 1933 Filed: 2018-07-25 AccNo: 0001144204-18-039762 Size: 1 MB 网页链接

$Summit Semiconductor, Inc(WISA)$ S-1/A [Amend] - General form for registration of securities under the Securities Act of 1933 Filed: 2018-07-23 AccNo: 0001144204-18-039204 Size: 2 MB 网页链接

$Summit Semiconductor, Inc(WISA)$ S-1/A [Amend] - General form for registration of securities under the Securities Act of 1933 Filed: 2018-07-06 AccNo: 0001144204-18-037573 Size: 1 MB 网页链接

$Summit Semiconductor, Inc(WISA)$ S-1/A [Amend] - General form for registration of securities under the Securities Act of 1933 Filed: 2018-07-02 AccNo: 0001144204-18-036769 Size: 7 MB 网页链接

$Summit Semiconductor, Inc(WISA)$ FWP - Filing under Securities Act Rules 163/433 of free writing prospectuses Filed: 2018-06-25 AccNo: 0001144204-18-035467 Size: 2 MB 网页链接

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